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SIC MOSFET MODULE MINI PACK

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MINI PACK集成了SiC MOSFET,将灵活性和功率密度推向极限,使平台能够覆盖200kW的应用。广泛应用于光伏逆变器、储能、PCS、APF以及充电桩等领域。MINI PACK结合SiC芯片和多种拓扑结构,在缩小系统体积、降低系统能耗、提升整机效率方面发挥重要作用。
MINI PACK integrates SiC MOSFET, pushing flexibility and power density to the limit, enabling the platform to cover 200kW applications. Widely used in fields such as solar inverters, energy storage, PCS, APF, and charging stations. MINI PACK, combined with SiC chips and various topologies, plays an important role in reducing system volume, lowering system energy consumption, and improving overall efficiency.
拓扑 Topology 半桥 half-bridge
RDS(ON)-Typ 6 / 11mΩ
应用领域 Applications 工业
状态 State 量产 output
产品优势指标参数拓扑电路应用领域
  • 宽禁带半导体材料:碳化硅(SiC) MOSFET

    WBG semiconductor material: Silicon Carbide MOSFET

  • 结构紧凑

    Compact design

  • 高功率密度

    High power density

  • 低杂散电感设计

    Low inductive design

  • 集成温度传感器NTC

    Integrated NTC temperature sensor







电路拓扑

circuit topology

半桥

Half-bridge

VDss

1200V

RDS(ON)-typ

6 / 11 mΩ

Tvj(op)

-55℃~175℃

Chip Material

SiC


mini pack拓扑.png

高效转换器

Highefficiency converter/inverter


太阳能应用

Solar applications


电动汽车充电桩

Electrical vehicle charging stations


工业电源

Industrial power