An integrated solution based on SiC MOSFET chips,

featuring ultra-high power density and reliability.

lTop 3 International Market Share

—— Largest domestic volume production and shipments,

with the most designated models for SiC traction power modules

lFlexible and Compatible for User Selection

——Pin-to-pin compatibility with mainstream market packages

——Multiple AC terminal options to match user dimensions

——Fish-eye signal pin design, supporting crimping or welding

——High-Performance SiC MOSFET Chips and Packaging Technology

lHigh performance SiCMOSFET chip and packaging process

——Built in SiC MOSFET chip, higher device operating

junction temperature and switching frequency

——Silver sintering technology for ultra-high reliability